Flip Chips and Sunken Ships: Packaging Trick for Faster, Smaller Semiconductors

You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die is flipped upside down so the active surface is closest to the PCB. As opposed to the more traditional method in which the …read more

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The Dual In-Line Package and How It Got That Way

For most of human history, our inventions and innovations have been at a scale that’s literally easy to grasp. From the largest cathedral to the finest pocket watch, everything that went into our constructions has been something we could see with our own eyes and manipulate with our hands. But in the middle of the 20th century, we started making really, really small stuff: semiconductors. For the first time, we were able to create mechanisms too small to be seen with the naked eye, and too fine to handle with our comparatively huge hands. We needed a way to scale …read more

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From Project To Kit: After The Sale

However you sell your kits online, you’ll have to find a means of shipping them to the customer. For an online operation this unseen part of the offering is more important than any other when it comes to customer satisfaction, yet so many large players get it so wrong.

This is the final article in a series looking on the process of creating and selling a commercial kit from a personal electronic project (read all the posts in this series). We’ve looked at the market, assembling the kit and its instructions, and how to set up an online sales channel. …read more

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