Flip Chips and Sunken Ships: Packaging Trick for Faster, Smaller Semiconductors

You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die is flipped upside down so the active surface is closest to the PCB. As opposed to the more traditional method in which the …read more

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Fail Of The Week: When the Epoxy-Coated Chip Is Conductive

Every once in a while, you’ll find some weirdness that will send your head spinning. Most of the time you’ll chalk it up to a bad solder joint, some bad code, or just your own failings. This time it’s different. This is a story of weirdness that’s due entirely to a pin that shouldn’t be there. This is a package for an integrated circuit that has a pin zero.

The story begins with [Erich] building a few development boards for the Freescale Kinetis K20 FPGA. This is a USB-enabled microcontroller, and by all accounts, a worthwhile effort. So far, so …read more

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